PACK EXPO International Approaches: Chicago, Nov 6-9

In News, Technology, Trends by Heather Brown0 Comments

PACK EXPO International’s 2016 conference happens in Chicago November 6-9. Anticipated topics revolve around automation developments in food packaging.

This year, innovation takes center stage. A robotics showcase sponsored by B&R Industrial Automation will feature remote monitoring, smart machines, and track-and-trace technology. Other high-profile subjects include industry growth and updates, as well as the future of the packaging industry workforce.

An interactive Clemson University exhibit will simulate grocery store shelves to help attendees understand the impact of packaging on consumers.

View the complete sessions listing to plan your conference or your research strategy. Follow @packexposhow on Twitter and the hashtag #PACKEXPO for updates and developments throughout the week.

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